Laird Performance Materials, an Advent International company with global headquarters in Shanghai, China, enables high-performance electronics. The low profile feature benefits in consumer electronics, industrial, and telecom design. System-level cooling: The thermal design of complex systems, such as high-performance computing systems, relies on extensive component-and system-level thermal management analysis to address the broad spectrum of issues that entail a comprehensive system design. Thermo-mechanical design and Modelling, Thermal Management and Design/Modelling/Simulation, 7: Active Cooling 1: Thermoelectric Generators, 8: Additive Manufacturing for Cooling Structures, Advanced thermal interface materials developments, testing, and characterization, Developments in CTE-matched thermal composites, graphite, and related heat spreader materials, Applications for vapor chambers and heat pipe assemblies, Single- and two-phase liquid cooling systems developments, Commercial and military/aerospace thermal solutions, Developments in power semiconductor thermal solutions, Innovations in CFD thermal modeling and characterization tools. Questions may be addressed to ttw2020@semi-therm.org. Click here to learn more about our Industry Sponsors! When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Accessibility Abstracts are solicited for technical presentations on electronics thermal management topics for presentation at this annual advanced technology workshop, include: The Only Conference Specifically Covering Thermal Materials, Materials, Compounds, Adhesives, Substrates, Laird Thermal Systems™ Premium Thermoelectric Coolers Provide Temperature Stability for Outdoor Security Cameras, Techsil & Panacol Offer a New Adhesive for Filament Winding Processes, Bergquist® Liqui-Form TLF 6000HG Thermal Gel Earns Industry Award, CoolIT Prevails Against Asetek, PTAB Determines No Challenged Claims Unpatentable, Heat-Blocking Defects Detected Acoustically, SEMI-THERM Thermal Technologies Workshops, NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance, SANYO DENKI 40 × 40 × 28 mm High Static Pressure Fan Achieves the Highest Static Pressure in the Industry, Ultra Low Thermal Resistant Adhesives for Electronic Applications, Thermal Management Online Conference Flyer (6 downloads). Download the Thermal Management Online Conference Flyer (6 downloads). Sponsored by Master Bond As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that … Download Now, 10novAll Day13SEMI-THERM Thermal Technologies Workshops. Terms and Conditions Laird Performance Materials has a global footprint and creates industry-leading solutions which protect electronics. Vadim Gektin, Member Technical Staff, NUVIA, Inc. Bill Maltz, President, Electronic Cooling Solutions, Inc. Nader Nikfar, Principal Thermal Engineer, Qualcomm Technologies, Inc. Adriana Rangel, Mechanical Engineer, Cisco Systems Inc. Dave Saums, Principal, DS&A LLC Tejas Shah, Senior Thermal Architect, Intel Corporation Guy Wagner, Director, Electronic Cooling Solutions, Inc. Ross Wilcoxon, Associate Director, Mechanical Engineering, Mission Systems, Collins Aerosace, Inc. All Rights Reserved.Privacy Policy | Cookie Policy.

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